| 发明名称 | Laser diode assembly | ||
| 摘要 | A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 μm is arranged between the laser diode chip and the mounting part. | ||
| 申请公布号 | US8867582(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201313857100 | 申请日期 | 2013.04.04 |
| 申请人 | OSRAM Opto Semiconductors GmbH | 发明人 | Strauss Uwe;Tautz Soenke;Lell Alfred;Auen Karsten;Vierheilig Clemens |
| 分类号 | H01S5/00;H01S5/022;H01S5/024;H01S5/028;H01S5/323 | 主分类号 | H01S5/00 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A laser diode assembly, comprising: a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction, wherein the housing part and the mounting part have a main body composed of copper and wherein the housing part is steel coated; a laser diode chip disposed on the mounting part, the laser diode chip having a semiconductor layers on a substrate, the semiconductor layers including an active layer for emitting light; and a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μm. | ||
| 地址 | Regensburg DE | ||