| 发明名称 | Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same | ||
| 摘要 | Semiconductor chips are provided. The semiconductor chip includes a semiconductor chip body having an arch-shaped groove in a backside thereof and a non-conductive material pattern filling the arch-shaped groove. Related methods are also provided. | ||
| 申请公布号 | US8866269(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201213719199 | 申请日期 | 2012.12.18 |
| 申请人 | SK Hynix Inc. | 发明人 | Nam Jong Hyun |
| 分类号 | H01L29/06;H01L23/00;H01L21/56;H01L21/78;H01L23/31 | 主分类号 | H01L29/06 |
| 代理机构 | William Park & Associates Patent Ltd. | 代理人 | William Park & Associates Patent Ltd. |
| 主权项 | 1. A semiconductor chip comprising: a semiconductor chip body having an arch-shaped groove in a backside thereof; and a non-conductive material pattern filling the arch-shaped groove, wherein a surface of the non-conductive material pattern is coplanar with a bottom surface of the semiconductor chip body. | ||
| 地址 | Gyeonggi-do KR | ||