| 发明名称 | Fan-out package comprising bulk metal | ||
| 摘要 | A device includes a polymer, a device die in the polymer, and a plurality of Through Assembly Vias (TAVs) extending from a top surface to a bottom surface of the polymer. A bulk metal feature is located in the polymer and having a top-view size greater than a top-view size of each of the plurality of TAVs. The bulk metal feature is electrically floating. The polymer, the device die, the plurality of TAVs, and the bulk metal feature are portions of a package. | ||
| 申请公布号 | US8866285(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201213604239 | 申请日期 | 2012.09.05 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hu Yen-Chang;Huang Chang-Chia;Hsiao Ching-Wen;Chen Chen-Shien |
| 分类号 | H01L23/04;H01L23/52 | 主分类号 | H01L23/04 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A package comprising: a polymer; a device die in the polymer; a plurality of Through Assembly Vias (TAVs) extending from a top surface to a bottom surface of the polymer; and a first bulk metal feature in the polymer and having a top-view size greater than a top-view size of each of the plurality of TAVs. | ||
| 地址 | Hsin-Chu TW | ||