发明名称 Morphology control of ultra-thin MeOx layer
摘要 A nonvolatile memory device contains a resistive switching memory element with improved device switching performance and life and methods for forming the same. The nonvolatile memory device has a first layer on a substrate, a resistive switching layer on the first layer, and a second layer. The resistive switching layer is disposed between the first layer and the second layer and the resistive switching layer comprises a material having the same morphology as the top surface of the first layer. A method of forming a nonvolatile memory element in a ReRAM device includes forming a resistive switching layer on a first layer and forming a second layer, so that the resistive switching layer is disposed between the first layer and the second layer. The resistive switching layer comprises a material formed with the same morphology as the top surface of the first layer.
申请公布号 US8866118(B2) 申请公布日期 2014.10.21
申请号 US201213724126 申请日期 2012.12.21
申请人 Intermolecular, Inc.;Kabushiki Kaisha Toshiba;SanDisk 3D LLC 发明人 Nardi Federico;Wang Yun
分类号 H01L29/02;H01L45/00 主分类号 H01L29/02
代理机构 代理人
主权项 1. A nonvolatile memory element, comprising: a first layer on a substrate; a resistive switching layer on the first layer; a second layer; wherein the resistive switching layer is disposed between the first layer and the second layer, and wherein the resistive switching layer comprises a material having the same morphology as a top surface of the first layer; a first sub-layer that comprises the material having the same morphology as a top surface of the first layer; and a second sub-layer comprising a material having a morphology that is different than the first sub-layer and the first layer, wherein the first layer and the first sub-layer each have a polycrystalline morphology and the second sub-layer has a crystalline morphology.
地址 San Jose CA US
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