LED COMPONENT BY INTEGRATING EPITAXIAL STRUCTURE AND PACKAGE SUBSTRATE TOGETHER AND METHOD OF MANUFACTURING THE SAME

摘要

In the present invention, disclosed are an integral LED component integrating LED epitaxial structures and electrodes and interconnecting with a package substrate together and to an integration manufacturing process thereof. The integral LED component is formed with a plurality of epitaxial structures or a single epitaxial structure. The integral LED component is mounted on a hollow cavity. A thermal conductive or dissipation device is mounted on the package substrate and is in contact with the package substrate by support by the hollow carrier. The integral LED component is manufactured by a wafer level process and is cut from the wafer as an independent component. The integral LED component is made as a vertical LED structure or a lateral LED structure by a different manufacturing process.