| 摘要 |
The present invention relates to a thin film deposition apparatus and, more specifically, to a thin film deposition apparatus performing deposition by evaporation. The film deposition apparatus includes: a process chamber configured to form a sealed treatment space; one or more evaporation source arranged in the process chamber to evaporate a depositing material; a substrate supporting section configured to support a substrate such that a substrate treatment surface can face the evaporation source; and an evaporation blocking section configured to partition the treatment space into a treatment region where the substrate is positioned and an evaporation region where the evaporation source is arranged, and to open and close an opening portion where the treatment region communicates with evaporation region, wherein the evaporation blocking section includes a pair of shutter parts arranged to be symmetrical to each other with respect to the center of the substrate mounted on the substrate supporting section, and configured to open and close the opening portion by linear movement; and a linear driving part configured to linearly move the shutter parts. |
