摘要 |
A component mounting system includes a component mounting device which mounts a component on a substrate and a component inspecting device which inspects the mounting state of the component mounted on the substrate by the component mounting device. If the component is supplied to the component mounting device, the mounting state of an initial component which is initially mounted on the substrate among the supplied components is inspected by the component inspecting device. [Reference numerals] (1) Solder; (10) Loader; (101) Circuit board manufacturing line; (10a,20a,30a,40a,50a,60a) Control unit; (20) Press; (30) Component mounting apparatus; (40) Component exterior inspection apparatus; (50) Reflow row; (60) Unloader; (70) Network hub; (80) Management computer; (80a) Control unit; (80b) Memory unit; (AA) Board transport direction; (BB) Production management information |