COATING SOLDER MATERIAL, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a solder material that never causes problems such as decrease of wettability and generation of cavities, even if used after a long period of time elapsed from manufacture.SOLUTION: An organo-silicon compound is mixed with a carrier gas and sprayed in a plasma gas under atmospheric pressure, and the organo-silicon compound is radicalized. The radicalized organo-silicon compound is reacted with metal existing on a surface of a solder material, while being subjected to plasma polymerization. Thereby, a coating film comprising a polysiloxane film having a film thickness of 4 nm to 200 nm is formed on the surface of the solder material. In this case, a coating amount to the whole coating solder material is more than 0 ppm and not more than 200 ppm in terms of silicon.