CONDUCTIVE PATTERN FORMING METHOD, RESIN COMPOSITION, CONDUCTIVE PATTERN, AND ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a conductive pattern forming method for forming a high-definition conductive pattern excellent in conductivity and adhesion, and to provide a resin composition, a conductive pattern, and an electronic circuit.SOLUTION: The conductive pattern forming method comprises the steps of: applying a resin composition which contains [A] a polymer containing a constituent unit having a polymerizable group, [B] a surfactant whose content is 0.5-10 pts.mass based on 100 pts.mass of the total resin composition, and a solvent to a substrate 1; subjecting at least a part of a coating film of the resin composition to at least one of irradiation and heating to form a base film 3; applying a conductive film forming ink onto the base film 3; and heating a coating film of the conductive film forming ink to form a conductive pattern 5. The electronic circuit is formed using the conductive pattern 5.