发明名称 EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
摘要 <p>The present invention includes: a dielectric layer; a ceramic body which has first and second main surface which face with each other, first and second side surface which face each other, and first and second cross-sectional areas which face with each other; first and second internal electrodes which are stacked by having the dielectric layer therebetween and have first and second leads which are exposed to the first and second sides of the ceramic body; first and second external electrodes which are extended from the first and second cross-sections of the ceramic body toward the first, second main surfaces and first and second sides. A substrate-embedded type multilayer ceramic electronic part which satisfies 30μm <= G1 < BW1 - M1 wherein G1 is the length from the end of the first and second external electrodes formed in the first and second sides of the ceramic body to the first and second external electrodes corresponding to the first and second leads, BW1 is the length from the end of the first and second external electrodes formed in the first and second sides of the ceramic body to the cross-section of the ceramic body, and M1 is the length from the cross-section of the ceramic body to the first and second external electrodes corresponding to the first and second leads. The first internal electrode is connected to the first external electrode through at least one first via which is extended to at least one of the first and second main surfaces of the ceramic body.The second internal electrode is connected to the second external electrode through at least one second via which is extended to at least one of the first and second main surfaces of the ceramic body.</p>
申请公布号 KR101452130(B1) 申请公布日期 2014.10.16
申请号 KR20130103713 申请日期 2013.08.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, HAI JOON;KIM, DOO YOUNG;LEE, BYOUNG HWA;CHAE, EUN HYUK
分类号 H01G4/30;H05K3/46 主分类号 H01G4/30
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