发明名称 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
摘要 The present invention relates to a nitride light emitting diode (LED) package, and more specifically, to a nitride light emitting diode package which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once, and can increase operating current.
申请公布号 US2014306248(A1) 申请公布日期 2014.10.16
申请号 US201314355373 申请日期 2013.04.26
申请人 PUKYONG NATIONAL UNIVERSITY INDUSTRY- UNIVERSITY COOPERATION FOUNDATION 发明人 Ahn Hyung Soo;Yang Min;Shin Kee Sam;Yi Sam Nyung;Lee Hyo Jong;Yu Moon Yeoung
分类号 H01L33/62;H01L33/36;H01L33/00 主分类号 H01L33/62
代理机构 代理人
主权项 1. A light emitting diode package, comprising; a substrate; a plurality of LED cells formed on the substrate; two or more groups including two or more cells; p type electrodes formed on top of the cells; insulation layer exposing underlying n layer with trench formed by etching a part of area around the cells; n type contact electrode which is elongated from the n layer of the cells and formed on n type nitride semiconductor layer exposed by trench; and two P type contact electrodes which are elongated from each p type electrodes of the two groups and formed on the insulation layer which is formed on the n type semiconductor,.
地址 Busan KR