发明名称 |
LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The present invention relates to a nitride light emitting diode (LED) package, and more specifically, to a nitride light emitting diode package which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once, and can increase operating current. |
申请公布号 |
US2014306248(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
US201314355373 |
申请日期 |
2013.04.26 |
申请人 |
PUKYONG NATIONAL UNIVERSITY INDUSTRY- UNIVERSITY COOPERATION FOUNDATION |
发明人 |
Ahn Hyung Soo;Yang Min;Shin Kee Sam;Yi Sam Nyung;Lee Hyo Jong;Yu Moon Yeoung |
分类号 |
H01L33/62;H01L33/36;H01L33/00 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting diode package, comprising;
a substrate; a plurality of LED cells formed on the substrate; two or more groups including two or more cells; p type electrodes formed on top of the cells; insulation layer exposing underlying n layer with trench formed by etching a part of area around the cells; n type contact electrode which is elongated from the n layer of the cells and formed on n type nitride semiconductor layer exposed by trench; and two P type contact electrodes which are elongated from each p type electrodes of the two groups and formed on the insulation layer which is formed on the n type semiconductor,. |
地址 |
Busan KR |