| 发明名称 |
DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING DIE-BONDING FILM |
| 摘要 |
A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein. |
| 申请公布号 |
US2014306357(A1) |
申请公布日期 |
2014.10.16 |
| 申请号 |
US201414315495 |
申请日期 |
2014.06.26 |
| 申请人 |
PARK Baek Soung;CHOI Jae Won;KIM Sung Min;KIM In Hwan;LEE Jun Woo;IM Su MI |
发明人 |
PARK Baek Soung;CHOI Jae Won;KIM Sung Min;KIM In Hwan;LEE Jun Woo;IM Su MI |
| 分类号 |
H01L23/544;H01L21/70 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dicing die-bonding film, comprising:
a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes: a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including:
a third region adjacent to the first region, anda fourth region adjacent to the third region and having a groove formed therein. |
| 地址 |
Uiwang-si KR |
