发明名称 LENS ARRAY PACKAGES AND IMAGE CAPTURING DEVICES INCORPORATING THE SAME
摘要 <p>Various features can be provided to help reduce or alleviate the effects of thermal expansion/contraction of a lens array material. Such features include stress release cuts in the surface(s) of the lens array, a frame having a low constant of thermal expansion (CTE) embedded within the lens array, or polymer fibers wrapped around the lens array or around the lens array housing. The features can be used alone or in conjunction with one or more of the other features for reducing or alleviating the effects of the thermal expansion/contraction. In addition, one or more parts of a housing for the lens array can be composed of a material having a relatively low CTE. The lens array package can be incorporated into a camera or other image capturing device.</p>
申请公布号 WO2014168586(A1) 申请公布日期 2014.10.16
申请号 WO2014SG00159 申请日期 2014.04.11
申请人 HEPTAGON MICRO OPTICS PTE. LTD. 发明人 ROSSI, MARKUS;RUDMANN, HARTMUT;CESANA, MARIO
分类号 G02B7/02;G01C11/00;G02B27/00;G03B41/00;G03G15/04 主分类号 G02B7/02
代理机构 代理人
主权项
地址