MAGNETRON SPUTTERING CATHODE, SPUTTERING APPARATUS INCLUDING THE CATHODE, SPUTTERING FILM DEPOSITION METHOD USING THE SPUTTERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a magnetron sputtering cathode which provides small variation in film thickness in sputtering deposition and improves utilization efficiency of a target.SOLUTION: A magnetron sputtering cathode 10 includes a magnetic field generating mechanism which includes a rectangular-ring shaped outer magnetic pole 18 provided corresponding to a peripheral part of a rectangular-shaped sputtering target 11, and a central magnetic pole 19 disposed in an inner side of the outer magnetic pole 18 so as to extend in a long side direction of the outer magnetic pole 18. The central magnetic pole 19 freely reciprocates in a short side direction of the outer magnetic pole 18, and the outer magnetic pole 18 freely reciprocates in the long side direction thereof.