发明名称 HIGH FREQUENCY CIRCUIT MODULE
摘要 A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
申请公布号 US2014308906(A1) 申请公布日期 2014.10.16
申请号 US201314063754 申请日期 2013.10.25
申请人 TAIYO YUDEN CO., LTD. 发明人 SAJI Tetsuo;NAKAMURA Hiroshi
分类号 H04B1/48 主分类号 H04B1/48
代理机构 代理人
主权项 1. A high frequency circuit module, comprising: a multilayer circuit substrate formed by alternately stacked insulating layers and conductive layers; a transmission filter that performs filtering on high frequency transmission signals; a reception filter that performs filtering on high frequency reception signals; and a first high frequency switch that switches connections of an antenna and the transmission and reception filters, wherein either one or both of the transmission filter and reception filter, and the first high frequency switch, are embedded in the multilayer circuit substrate, and wherein a first ground conductor is formed in a first conductive layer located above the first high frequency switch and each embedded filter in the multilayer circuit substrate, the first ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter, and wherein a second ground conductor is formed in a second conductive layer located below the first high frequency switch and each embedded filter in the multilayer circuit substrate, the second ground conductor being formed in regions facing at least the first high frequency switch and each embedded filter.
地址 Tokyo JP