发明名称 |
SOLVENT-FREE SILICONE ADHESIVE AGENT COMPOSITION AND ADHESIVE ARTICLE |
摘要 |
Provided is a solvent-free silicone adhesive agent composition comprising: (A) an organopolysiloxane which has at least two alkenyl-group-containing organic group per molecule in an amount of 40 to 95 parts by mass; (B) an organopolysiloxane which is composed of a R2 3SiO1/2 unit (wherein R2's independently represent a monovalent hydrocarbon group that has 1 to 10 carbon atoms and does not have an aliphatic unsaturated bond or an alkenyl group that has 2 to 6 carbon atoms) and a SiO4/2 unit and has a (R2 3SiO1/2 unit)/(SiO4/2 unit) ratio of 0.6 to 1.0 by mole in an amount of 5 to 60 parts by mass, wherein the total amount of the components (A) and (B) is 100 parts by mass; (C) an organohydrogenpolysiloxane which has at least three Si-H groups per molecule and has a Si-H modification ratio of 30 mol% or more in such an amount that ratio of the amount of the Si-H groups to the amount of the alkenyl groups in the component (A) becomes 0.2 to 10 by mole; and (D) a platinum group metal catalyst. The solvent-free silicone adhesive agent composition can be cured at a temperature as low as 100°C or lower |
申请公布号 |
WO2014167898(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
WO2014JP54144 |
申请日期 |
2014.02.21 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TSUCHIDA OSAMU |
分类号 |
C09J183/07;C09J7/02;C09J11/04;C09J183/05 |
主分类号 |
C09J183/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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