发明名称 SILICON SUBSTRATE MEMS DEVICE
摘要 <p>A MEMS device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other. The silicon substrate also includes a through hole with a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to a surface of the silicon substrate.</p>
申请公布号 WO2014168782(A1) 申请公布日期 2014.10.16
申请号 WO2014US32448 申请日期 2014.04.01
申请人 EASTMAN KODAK COMPANY 发明人 XIE, YONGLIN;ELLINGER, CAROLYN, R.;EVANS, MARK, D.;JECH, JOSEPH
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
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