<p>A MEMS device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other. The silicon substrate also includes a through hole with a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to a surface of the silicon substrate.</p>
申请公布号
WO2014168782(A1)
申请公布日期
2014.10.16
申请号
WO2014US32448
申请日期
2014.04.01
申请人
EASTMAN KODAK COMPANY
发明人
XIE, YONGLIN;ELLINGER, CAROLYN, R.;EVANS, MARK, D.;JECH, JOSEPH