| 摘要 |
PURPOSE: A carrier member, manufacturing method, and PCB(printed circuit board) manufacturing method using the same are provided to prevent a gap from being generated in a release layer by preventing the release layer from being exposed to the outside. CONSTITUTION: A first metal plate(103a) is formed on an upper surface or a lower surface of an insulation material. A second metal plate(103b) is exposed to a boundary of the first metal plate. A second insulation material is formed on a first insulation material. A release film is formed on an inner surface where the first insulation material faces to the second insulation material. A release layer(103c) is formed between the first metal plate and the second metal plate. |
