| 发明名称 | Method and system for controlling chip inclination during flip-chip mounting | ||
| 摘要 | A method for alignment of a first substrate coupled to a second substrate includes determining an inclination angle for the first substrate or the second substrate due to warpage. The method includes determining a joint height difference based on the inclination angle and configuring a size for one or more bond pads based on the joint height difference. | ||
| 申请公布号 | US8859335(B2) | 申请公布日期 | 2014.10.14 |
| 申请号 | US201213667727 | 申请日期 | 2012.11.02 |
| 申请人 | Fujitsu Limited | 发明人 | Lee Michael G.;Uchibori Chihiro |
| 分类号 | H01L21/00 | 主分类号 | H01L21/00 |
| 代理机构 | Baker Botts L.L.P. | 代理人 | Baker Botts L.L.P. |
| 主权项 | 1. A method for alignment of a first substrate coupled to a second substrate, comprising: determining an inclination angle for the first substrate or the second substrate due to warpage; determining a joint height difference based on the inclination angle; and configuring a size for one or more bond pads based on the joint height difference. | ||
| 地址 | Kawasaki-shi JP | ||