Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices

摘要

Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.

主权项

1. A method, comprising:
receiving a supply voltage at two or more supply voltage bond fingers positioned on, over, or in a first surface of a substrate, wherein one or more supply voltage bond finger interconnects each electrically interconnects two or more of the supply voltage bond fingers; and transmitting the supply voltage from the two or more supply voltage bond fingers to a plurality of supply voltage bond pads positioned on an integrated circuit die, wherein the plurality of supply voltage bond pads are electrically connected via one or more supply voltage bond pad interconnects, and wherein at least one supply voltage bond pad is electrically connected to two other supply voltage bond pads through at least two supply voltage bond pad interconnects, the integrated circuit die positioned on, over, or in the first surface of the substrate.