| 发明名称 | Method for assembling a circuit board | ||
| 摘要 | Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step. | ||
| 申请公布号 | US8859907(B2) | 申请公布日期 | 2014.10.14 |
| 申请号 | US201213599984 | 申请日期 | 2012.08.30 |
| 申请人 | Schoeller-Electronics GmbH | 发明人 | Berkel Jan Hendrik |
| 分类号 | H05K1/02;F28F21/00;H05K3/30;H01L23/367;H01L23/36;H05K3/00;H01L23/00;H01L25/065 | 主分类号 | H05K1/02 |
| 代理机构 | Pauly, Devries Smith & Deffner, LLC | 代理人 | Pauly, Devries Smith & Deffner, LLC |
| 主权项 | 1. A method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or in a semifinished circuit board part and wherein at least one semiconductor die of a semiconductor component is applied to the inserted flange insert in a subsequent application step. | ||
| 地址 | Wetter/Hessen DE | ||