| 发明名称 | Molded interposer package and method for fabricating the same | ||
| 摘要 | A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. | ||
| 申请公布号 | US8859340(B2) | 申请公布日期 | 2014.10.14 |
| 申请号 | US201414154564 | 申请日期 | 2014.01.14 |
| 申请人 | MediaTek Inc. | 发明人 | Gregorich Thomas Matthew;Chang Andrew C.;Lin Tzu-Hung |
| 分类号 | H01L21/00;H01L21/44;H01L23/52;H01L23/498;H01L21/56;H01L25/065;H01L25/10;H01L23/367;H01L23/31;H01L23/00 | 主分类号 | H01L21/00 |
| 代理机构 | McClure, Qualey & Rodack, LLP | 代理人 | McClure, Qualey & Rodack, LLP |
| 主权项 | 1. A method for fabricating a molded interposer package, comprising: providing a metal sheet having a top surface and a bottom surface; performing a first anisotropic etching process to remove a portion of the metal sheet from the top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet, thereby forming a plurality of second recesses in the metal sheet, wherein the first recesses and the second recesses communicate with each other, respectively; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; removing the carrier; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. | ||
| 地址 | Hsin-Chu TW | ||