发明名称 Light-emitting device package
摘要 A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.
申请公布号 US8860073(B2) 申请公布日期 2014.10.14
申请号 US201213709302 申请日期 2012.12.10
申请人 Samsung Electronics Co., Ltd. 发明人 Park Hun-yong;Kim Choo-ho;Jung Won-ho;Hong Jin-ki
分类号 H01L33/00;H01L33/54;H01L33/46;H01L33/48;H01L33/62;H01L33/60 主分类号 H01L33/00
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A light-emitting device package comprising: a pre-mold including an upper body and a lower body, the upper body having a inclined plane from which a plurality of vertical holes passing through the upper body are formed and the lower body having an upper surface configured to contact the inclined plane under the upper body to form a concave unit; a pair of leads between the upper body and the lower body, the pair of leads separate from each other; a light-emitting device on one of the pair of leads; a wire configured to connect the light-emitting device to at least one of the pair of leads; and a molding member configured to fill the plurality of vertical holes and the concave unit.
地址 Gyeonggi-do KR