METHOD FOR THERMAL IMAGING DIAGNOSTICS OF RADIOELECTRONIC ELEMENTS ON PRINTED-CIRCUIT BOARD

摘要

FIELD: radio engineering, communication.SUBSTANCE: invention relates to diagnostics of radioelectronic equipment failures. A method consists in reception of a thermal image of radioelectronic elements on a printed-circuit board and its comparison with a standard thermal image. On the thermal image of elements on the printed-circuit board being diagnosed there determined are relative coordinates and values of radiation temperature of elements on the printed-circuit board as per relative coordinates of elements on the printed-circuit board being diagnosed; a standard thermal image of the printed-circuit board is chosen out of the earlier formed data bank; resemblance function S is calculated between radiation temperatures of the corresponding elements on the diagnosed and standard printed-circuit boards; diagnostics of serviceability of each element on the diagnosed printed-circuit board is performed by checking condition (T?T?T),where T- radiation temperature of j element on the diagnosed printed-circuit board, °C; T- minimum possible radiation temperature of j element on the diagnosed printed-circuit board; T- maximum possible radiation temperature of j element on the diagnosed printed-circuit board.EFFECT: technical result consists in improvement of diagnostics efficiency of radioelectronic equipment or its individual elements by means of a non-contact method.