发明名称 |
MONOLITHIC CERAMIC ELECTRONIC COMPONENT |
摘要 |
Fixing force between a plating film which serves as an outer electrode and a component body may be weak when the outer electrode of a monolithic ceramic capacitor is formed by applying direct plating onto a surface of the component body. A monolithic ceramic electronic component includes an outer electrode (16) including a first plating layer (20) formed directly on a component body (2) by electroless plating in order to cover an exposed portion distribution region (18) including exposed portions of a plurality of inner electrodes (4) and a second plating layer (21) formed by electrolytic plating in order to cover the first plating layer (20). An amount of extension of the first plating (E1) which represents a distance from an edge of the exposed portion distribution region (18) to an edge of the first plating layer (20) and an amount of extension of the second plating (E2) which represents a distance from the edge of the first plating layer (20) to an edge of the second plating layer (21) satisfy the relationship E1/(E1+E2)<=20%. |
申请公布号 |
KR20140119645(A) |
申请公布日期 |
2014.10.10 |
申请号 |
KR20140037468 |
申请日期 |
2014.03.31 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SASABAYASHI TAKEHISA;MOTOKI AKIHIRO;OGAWA MAKOTO |
分类号 |
H01G4/232;H01G4/30 |
主分类号 |
H01G4/232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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