发明名称 |
PRODUCTION METHOD OF GROUP III NITRIDE SUBSTRATE, AND DISLOCATION DENSITY REDUCTION METHOD OF GROUP III NITRIDE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for obtaining easily and surely a group III nitride substrate having a low dislocation density.SOLUTION: A production method of a group III nitride substrate includes: an etching step for forming a recessed part on the surface of a ground substrate so that a C-surface ratio becomes 20% or higher and 90% or lower, by applying chlorine plasma etching to the surface of the ground substrate whose surface is the flat C-surface in the state where a bias voltage is not applied to the ground substrate; and a formation step for forming a group III nitride layer on the ground substrate after the etching step. |
申请公布号 |
JP2014193789(A) |
申请公布日期 |
2014.10.09 |
申请号 |
JP20130070792 |
申请日期 |
2013.03.29 |
申请人 |
NGK INSULATORS LTD |
发明人 |
IWATA YUICHI;SUMIYA SHIGEAKI;KURAOKA YOSHITAKA |
分类号 |
C30B29/38;C30B19/12;H01L21/3065 |
主分类号 |
C30B29/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|