| 发明名称 |
Warpage Control for Flexible Substrates |
| 摘要 |
Flexible structures and method of providing a flexible structure are disclosed. In some embodiments, a method of providing a flexible structure includes: providing a flex substrate having a device bonded to a first side of the flex substrate; and attaching a rigid layer to a second side of the flex substrate opposite the first side using an adhesive layer. |
| 申请公布号 |
US2014302642(A1) |
申请公布日期 |
2014.10.09 |
| 申请号 |
US201414310377 |
申请日期 |
2014.06.20 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Lin Shih Ting;Lin Jing-Cheng;Hou Shang-Yun;Lu Szu Wei |
| 分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
providing a flex substrate having a device bonded to a first side of the flex substrate; and attaching a rigid layer to a second side of the flex substrate opposite the first side using an adhesive layer. |
| 地址 |
Hsin-Chu TW |
