发明名称 MULTI-MODE ETCH CHAMBER SOURCE ASSEMBLY
摘要 <p>A multi-chambered processing platform includes one or more multi-mode plasma processing systems. In embodiments, a multi-mode plasma processing system includes a multi-mode source assembly having a primary source to drive an RF signal on a showerhead electrode within the process chamber and a secondary source to generate a plasma with by driving an RF signal on an electrode downstream of the process chamber. In embodiments, the primary 7 source utilizes RF energy of a first frequency, while the secondary source utilizes RF energy of second, different frequency. The showerhead electrode is coupled to ground through a frequency dependent filter that adequately discriminates between the first and second frequencies for the showerhead electrode to be RF powered during operation of the primary source, yet adequately grounded during operation of the secondary plasma source without electrical contact switching or reliance on physically moving parts.</p>
申请公布号 WO2014163909(A1) 申请公布日期 2014.10.09
申请号 WO2014US18802 申请日期 2014.02.26
申请人 APPLIED MATERIALS, INC. 发明人 BELOSTOTSKIY, SERGEY G.;MARCACCI, ALEXANDER;RAMASWAMY, KARTIK;NEMANI, SRINIVAS D.;NGUYEN, ANDREW;SARODE, YOGANANDA
分类号 H01L21/3065 主分类号 H01L21/3065
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