SOLDER POWDER AND PASTE FOR SOLDER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide solder powder that hardly causes remelting and a decrease in joint strength after reflow and that is suitable particularly for mounting of an electronic component exposed to high-temperature atmosphere and the like, and paste for solder using the same.SOLUTION: Solder powder 10 includes a core 11 and a coating layer 12 for coating the core 11; the core 11 is made of copper, and an intermetallic compound of copper and tin; and the coating layer 12 is made of tin. Characteristically, an average particle diameter of the solder powder 10 is 30 μm or less, and the content rate of copper is more than 2.0 mass% and 40 mass% or less with respect to 100 mass% of the total amount of the solder powder 10.