SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same which can prevent reduction of a short circuit and voltage-withstanding between wiring due to a metal residue caused by reformation of the wiring.SOLUTION: A semiconductor device is provided with a recess part pattern for polishing acceleration in which a barrier film is formed on a surface in a region having coarse embedded wiring.