METHOD OF FORMING REWORKABLE, THERMALLY CONDUCTIVE AND ELECTRICALLY RESISTIVE BONDING STRUCTURE IN SUPERCONDUCTOR MULTI-CHIP MODULE USING REWORKABLE EPOXY BONDING COMPOSITES AND APPLICATION OF THE SAME

摘要

In one aspect, the present invention relates to a method of forming a reworkable, thermally conductive and electrically resistive material as a bonding structure in a module and application of the same. In certain embodiments, a homogeneous solution is prepared with an anisotropic structure, such as single-wall carbon nanotubes (SWCNTs), and an epoxy resin. The homogeneous solution is applied between a carrier and a chip of the module, and cured at a curing temperature for a curing time period to form a reworkable epoxy bonding layer, which has an anisotropic structure loading factor of about 0.1%-1.0% such that the reworkable epoxy bonding layer is thermally conductive and electrically resistive. When the chip is identified as a faulty chip, the module may be heated at a debonding temperature for a debonding time period such that the reworkable epoxy bonding layer debonds, and the chip becomes detachable from the carrier.

主权项

1. A method of applying a reworkable, thermally conductive and electrically resistive material as a bonding structure in a module with a carrier and at least one chip, comprising:
(a) purifying an anisotropic structure; (b) dispersing the purified anisotropic structure in a solvent to form a mixture; (c) adding an epoxy resin in the mixture to form an anisotropic structure-epoxy solution; (d) forming a homogeneous mixture by heating and stirring the anisotropic structure-epoxy solution for a first time period to evaporate the solvent; (e) cooling the homogeneous mixture at room temperature for a second time period, and adding a hardener in the cooled homogeneous mixture to form a homogeneous solution; (f) applying the homogeneous solution between the carrier and the chip of the module, and curing the homogeneous solution at a curing temperature for a curing time period to form a reworkable epoxy bonding layer between the carrier and the chip such that the chip is attached to the carrier by the reworkable epoxy bonding layer, wherein an anisotropic structure loading factor of the reworkable epoxy bonding layer is about 0.1%-1.0% such that the reworkable epoxy bonding layer is thermally conductive and electrically resistive, and wherein the reworkable epoxy bonding layer is configured to debond at a debonding temperature for a debonding time period such that the chip is detachable from the carrier; and (g) when the chip is identified as a faulty chip, detaching the faulty chip from the carrier by heating the module at the debonding temperature for the debonding time period, and performing a cleaning procedure to the detached chip and the detached carrier to reduce residues of the reworkable epoxy bonding layer on the detached chip and the detached carrier, such that a replacement chip is attachable to the carrier to replace the faulty chip, wherein the debonding temperature is about 63-170° C., and the debonding time period is about 1-25 minutes.