发明名称 POLYAMIDE MOLDING COMPOUNDS
摘要 The present invention relates to thermoplastic molding compositions comprising: A) from 80 to 99.5% by weight, based on components A and B, of a polyamide A;B) from 0.5 to 20% by weight, based on components A and B, of a copolyester B having an intrinsic viscosity according to DIN 53728 of from 150 to 320 cm3/g comprising: B1) from 40 to 80% by weight, based on the total weight of components B1 and B2, of at least one succinic, adipic, azelaic, sebacic or brassylic acid, or their ester-forming derivatives, or a mixture thereof,B2) from 20 to 60% by weight, based on the total weight of components B1 and B2, of terephthalic acid, or its ester-forming derivatives, or a mixture thereof,B3) from 98 to 102 mol %, based on components B1 and B2, of 1,4-butanediol or 1,3-propanediol, or a mixture thereof, as diol component,B4) from 0 to 1% by weight, based on component B, of a branching agent,B5) from 0 to 2% by weight, based on component B, of a chain extender,B6) from 0 to 2% by weight, based on component B, of further additional materials;C) from 0 to 60% by weight, based on components A to D, of a fibrous reinforcing material C;D) from 0 to 10% by weight, based on components A to D, of further additional materials D.;The invention further relates to a process for increasing the notched impact resistance in polyamides, and also to the use of the abovementioned molding compositions for producing fibers, foils, and moldings, and also to fibers, foils, and moldings obtainable from said molding compositions.
申请公布号 US2014303311(A1) 申请公布日期 2014.10.09
申请号 US201214346407 申请日期 2012.09.12
申请人 Jain Sachin;Nalawade Sameer 发明人 Jain Sachin;Nalawade Sameer
分类号 C08L77/02 主分类号 C08L77/02
代理机构 代理人
主权项
地址 Jalgaon MH IN