发明名称 Semiconductor Component Having a Semiconductor Body with a Cutout
摘要 A semiconductor component includes a semiconductor body having a surface and a cutout in the semiconductor body. The cutout extends from the surface of the semiconductor body into the semiconductor body in a direction perpendicular to the surface. The cutout has a base and at least one sidewall. The component further includes a layer on the surface of the semiconductor body and in the cutout. The layer forms a well above the cutout. The well has a well base, a well edge and at least one well sidewall. The at least one well sidewall forms an angle α in the range of 20° to 80° with respect to the surface of the semiconductor body. The layer has at least one edge which, proceeding from the well edge, extends in the direction of the surface of the semiconductor body.
申请公布号 US2014299933(A1) 申请公布日期 2014.10.09
申请号 US201414294548 申请日期 2014.06.03
申请人 Infineon Technologies Austria AG 发明人 Poelzl Martin
分类号 H01L29/423;H01L29/40;H01L29/78 主分类号 H01L29/423
代理机构 代理人
主权项
地址 Villach AT