WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATION DEVICE

摘要

A wafer-related data creation device including a setting stand for setting wafer pallets, a test-use suction nozzle for picking up die on dicing sheet of a wafer pallet set on the setting stand, a test-use pusher pin for pushing up the adhesive section of die from dicing sheet which is being attempted to be picked up by test-use suction nozzle, and a test-use camera for capturing an image of die on dicing sheet is used. The wafer pallet for which wafer-related data is to be created is set on the setting stand of wafer-related device creation device, an image captured by test-use camera is processed, pusher movement of test-use pusher pin and die pickup movement of test-use pickup nozzle is performed, and wafer-related data is created.

主权项

1. A wafer-related data management method which manages the wafer-related data used by a die supply device which performs pickup by picking up a die from a dicing sheet with a suction nozzle while partially separating the adhesive section of the die from the dicing sheet by using a pusher pin to raise the adhesive section of the die on the dicing sheet which is being attempted to be picked up, which is done when performing pickup by picking up a die on the dicing sheet by lowering the suction nozzle, after setting a wafer pallet stretched across which is a stretchable dicing sheet on which is affixed a wafer which has been diced so that multiple dies are divided, and performing image recognition of the position of the die by capturing an image of the die on the dicing sheet with a camera, wherein: wafer data is created using a wafer-related data creation device comprising a setting stand for setting the wafer pallet which is the target for the wafer-related data creation, a test-use suction nozzle for picking up the die on the dicing sheet of the wafer pallet set on the setting stand, a test-use pusher pin for pushing up the adhesive section of the die on the dicing sheet which is being attempted to be picked up by the test-use suction nozzle, and a test-use camera for capturing images of the die on the dicing sheet, wherein the wafer pallet which is the target for the wafer-related data creation is set on the setting stand of the wafer-related data creation device, the image captured by the test-use camera is processed, and push movement of the test-use pusher pin and die pickup movement of the test-use suction nozzle are performed.