发明名称 |
EPOXY FORMULATIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES |
摘要 |
The present invention is directed to a permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more epoxy resins according to Formulas I-VI, (B) one or more cationic photoinitiators; (C) one or more film casting solvents; and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed composition. |
申请公布号 |
US2014302430(A1) |
申请公布日期 |
2014.10.09 |
申请号 |
US201214241745 |
申请日期 |
2012.09.05 |
申请人 |
Nawrocki Daniel J.;Golden Jeremy V.;Weber William D. |
发明人 |
Nawrocki Daniel J.;Golden Jeremy V.;Weber William D. |
分类号 |
G03F7/038 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
1. A permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising:
(A) one or more epoxy resins; (B) one or more cationic photoinitiators; (C) one or more film casting solvents; and (D) one or more fluorinated compounds. |
地址 |
Chicopee MA US |