发明名称 MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY
摘要 A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.
申请公布号 WO2014163989(A1) 申请公布日期 2014.10.09
申请号 WO2014US19685 申请日期 2014.02.28
申请人 INVENSENSE, INC. 发明人 ATA, ERHAN, POLATKAN;LIM, MARTIN;LI, XIANG;LLOYD, STEPHEN;DANEMAN, MICHAEL, JULIAN
分类号 H01L29/96;H01L29/84;H01L29/86 主分类号 H01L29/96
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