DYNAMIC DESIGN ATTRIBUTES FOR WAFER INSPECTION

摘要

Methods and systems for dynamic design attributes for wafer inspection are provided. One method includes, at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning (DBB) process. The information includes one or more formulae for calculating design attributes from a design for a wafer. The design attributes are used to bin the defects in the DBB process. The method also includes performing inspection of a wafer according to an updated wafer inspection recipe. Performing the inspection includes binning defects detected on the wafer according to the DBB process in the updated wafer inspection recipe.

主权项

1. A method for wafer inspection, comprising:
at run time of a wafer inspection recipe, prompting a user of a wafer inspection tool on which the wafer inspection recipe is performed for information for a design based binning process, wherein the information comprises one or more formulae for calculating design attributes from a design for a wafer, and wherein the design attributes are used to bin the defects in the design based binning process; receiving the information from the user: updating the wafer inspection recipe based on the received information; and performing inspection of a wafer according to the updated wafer inspection recipe, wherein said performing comprises:
scanning at least a portion of the wafer with the wafer inspection tool thereby generating output responsive to light from at least the portion of the wafer;detecting defects on the wafer based on the output; andbinning the defects detected on the wafer according to the design based binning process in the updated wafer inspection recipe, wherein the prompting, receiving, updating, performing, scanning, detecting, and binning steps are performed by the wafer inspection tool.