COPPER FOIL WITH CARRIER, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which is appropriate for fine-pitch formation.SOLUTION: In the copper foil with the carrier, after the extremely thin copper layer is exfoliated, when etching is performed from a side of an exfoliated surface to the extremely thin copper layer until a value C of a ratio of thickness A(μm) of the extremely thin copper layer before etching and corresponding thickness B(μm) of the extremely thin copper layer removed by etching (=A(μm)/B(μm)) becomes C=0.227×log(thickness A(μm) of the extremely thin copper layer before etching)+0.26, residual copper of a diameter equal to or larger than 10μm on an etching surface of the extremely thin copper layer is 5/dmor less.