PATTERN FORMING METHOD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

The objective of the present invention is to provide: a pattern forming method which is suppressed in collapse or separation of a pattern even in cases where a fine pattern having a high aspect ratio is formed; a method for manufacturing an electronic device, which comprises this pattern forming method; and an electronic device which is manufactured by this manufacturing method. A pattern forming method according to the present invention comprises: an adhesion promoting layer formation step wherein an adhesion promoting layer comprising a polymerizable group and having a light transmittance of 80% or more at a wavelength of 193 nm is formed on a substrate; a resist film formation step wherein a resist film is formed on the adhesion promoting layer by applying a radiation-sensitive resin composition thereto; an exposure step wherein the resist film is exposed; and a development step wherein a pattern is formed by developing the exposed resist film.