发明名称 |
Herstellung einer Leiterbahnstruktur und Substrat mit solcher Struktur |
摘要 |
<p>A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.</p> |
申请公布号 |
DE112012004940(T8) |
申请公布日期 |
2014.10.09 |
申请号 |
DE20121104940T |
申请日期 |
2012.11.27 |
申请人 |
TAIWAN GREEN POINT ENTERPRISES CO., LTD. |
发明人 |
YI, SHENG-HUNG;LIAO, PEN-YI;CHEN, MIN-HSIANG |
分类号 |
H05K3/10;H05K1/14;H05K3/06 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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