发明名称 LAMINATE BODY USED FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminate body having a first light shielding conductive layer with high excoriation resistance.SOLUTION: A laminate body includes: a first transparent conductive layer having light transmissivity and conductivity arranged on one side of a substrate film: and a first light shielding conductive layer having light shielding property and conductivity arranged on one side of the first transparent conductive layer. The first light shielding conductive layer has silver as a principal component and silver alloy containing copper and palladium. A proportion of a copper content in the silver alloy of the first light shielding conductive layer is within a range of 3.0-7.0 wt.%.</p>
申请公布号 JP2014193590(A) 申请公布日期 2014.10.09
申请号 JP20130085949 申请日期 2013.04.16
申请人 DAINIPPON PRINTING CO LTD 发明人 OKAWA KOJIRO;WATANABE YUKA;TAZAWA HIDETANE;SATO HIROSHI
分类号 B32B15/08 主分类号 B32B15/08
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