发明名称 |
LAMINATE BODY USED FOR MANUFACTURING ELECTRONIC COMPONENT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laminate body having a first light shielding conductive layer with high excoriation resistance.SOLUTION: A laminate body includes: a first transparent conductive layer having light transmissivity and conductivity arranged on one side of a substrate film: and a first light shielding conductive layer having light shielding property and conductivity arranged on one side of the first transparent conductive layer. The first light shielding conductive layer has silver as a principal component and silver alloy containing copper and palladium. A proportion of a copper content in the silver alloy of the first light shielding conductive layer is within a range of 3.0-7.0 wt.%.</p> |
申请公布号 |
JP2014193590(A) |
申请公布日期 |
2014.10.09 |
申请号 |
JP20130085949 |
申请日期 |
2013.04.16 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
OKAWA KOJIRO;WATANABE YUKA;TAZAWA HIDETANE;SATO HIROSHI |
分类号 |
B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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