POSITIVE-TYPE PHOTORESIST COMPOSITION, INSULATING FILM AND OLED COMPRISING THE SAME

摘要

The present invention relates to a positive-type photosensitive resin composition which is a positive-type photosensitive resin composition including an alkali-soluble polyamic acid-polyimide copolymer resin, a diazide-based photosensitive compound, a sensitivity enhancing agent, and a solvent, which improves the alkali-soluble polyamic acid-polyimide copolymer resin to have high resolution and an improved contacting force.