发明名称 |
APPARATUS FOR MOUNTING A TRANSDUCER IN A WIRE BONDER |
摘要 |
<p>Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus: i) a flexural structure having a connector for connecting the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.</p> |
申请公布号 |
PH12013000084(A1) |
申请公布日期 |
2014.10.08 |
申请号 |
PH12013000084 |
申请日期 |
2013.03.14 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD. |
发明人 |
WONG, YAM MO;KWAN, KA SHING;LI, HING LEUNG;LI, XIANG CHAO |
分类号 |
B23K31/00;B23K31/02;B23K37/00 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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