| 摘要 |
According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflectance of an Ag-plated reflective layer formed on the surface of the lead frame. Concave parts are densely formed on the surface of the Cu-Fe based copper alloy strip, in which the concave part has surface roughness, 0.2 μm or less of Ra, 1.2 μm or less of Rz_JIS, and 1.5 μm or less of Rz in a rolling vertical direction, an average length of 2-100 μm in a rolling horizontal direction, an average length of 1-30 μm in the rolling vertical direction, and the maximum depth of 400 nm or less in the rolling horizontal direction. In this case, Ra, Rz_JIS, and Rz represent arithmetic average roughness, ten-point average roughness, and the maxim height roughness, respectively. The Cu-Fe based copper alloy strip contains 1.8-2.6 mass% of Fe, 0.005-0.20 mass% of P, and 0.01-0.50 mass% of Zn, or contains 0.01-0.5 mass% of Fe, 0.01-0.20 mass% of P, 0.01-1.0 mass% of Zn, 0.01-0.15 mass% of Sn, and a remainder substantially consisting of Cu and an inevitable material. |
