SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor package and a method for manufacturing the same and, more specifically, to a semiconductor package capable of reducing a number of processes and the manufacturing costs by newly improving an electromagnetic wave shielding layer forming structure of a package-on-package. The present invention stacks the upper semiconductor package and the lower semiconductor package in advance to be conductive and forms the electromagnetic wave shielding layer, at the same time, over the upper surface and the side surface of the upper and the lower semiconductor packages stacked vertically, thereby reducing the number of manufacturing processes and the manufacturing costs.