| 发明名称 | Bump structures | ||
| 摘要 | The embodiments of bump and bump-on-trace (BOT) structures provide bumps with recess regions for reflowed solder to fill. The recess regions are placed in areas of the bumps where reflow solder is most likely to protrude. The recess regions reduce the risk of bump to trace shorting. As a result, yield can be improved. | ||
| 申请公布号 | US8853853(B2) | 申请公布日期 | 2014.10.07 |
| 申请号 | US201113192302 | 申请日期 | 2011.07.27 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chang Chih-Horng;Kuo Tin-Hao;Chen Chen-Shien;Lin Yen-Liang |
| 分类号 | H01L23/48 | 主分类号 | H01L23/48 |
| 代理机构 | Lowe Hauptman & Ham, LLP | 代理人 | Lowe Hauptman & Ham, LLP |
| 主权项 | 1. An elongated bump structure, comprising: a copper layer, and a solder layer; wherein the elongated bump structure has a recess region for the solder layer to fill after the solder layer is reflowed. | ||
| 地址 | TW | ||