Metal inks for improved contact resistance

摘要

Metal ink compositions, methods of forming such compositions, and methods of forming conductive layers are disclosed. The ink composition includes a bulk metal, a transition metal source, and an organic solvent. The transition metal source may be a transition metal capable of forming a silicide, in an amount providing from 0.01 to 50 at. % of the transition metal relative to the bulk metal. Conductive structures may be made using such ink compositions by forming a silicon-containing layer on a substrate, printing a metal ink composition on the silicon-containing layer, and curing the composition. The metal inks of the present invention have high conductivity and form low resistivity contacts with silicon, and reduce the number of inks and printing steps needed to fabricate integrated circuits.

主权项

1. An ink composition comprising:
a) a bulk metal in an amount of about 1 to 30% by weight of the ink composition; b) a transition metal source comprising a transition metal other than the bulk metal and capable of forming a silicide, in an amount providing from 0.01 to 50 at. % of the transition metal relative to the bulk metal; and c) an organic solvent.