发明名称 Light emitting diode cable and heat sink
摘要 A high output light emitting diode (LED) based lighting module includes a plurality of LEDs on a substrate board, a fiber optic mounting assembly that securely holds a plurality of fiber bundles that form a fiber cable to said LEDs so that each LED mates to a fiber bundle making each fiber bundle slightly overlap the active area of its respective LED and mechanical means for holding each fiber optic bundle a fixed distance from said LED substrate.
申请公布号 US8853727(B1) 申请公布日期 2014.10.07
申请号 US201213711073 申请日期 2012.12.11
申请人 发明人 Sanso David;Williams Mason;Hymel Brent;Pitzer Aaron
分类号 H01L29/22 主分类号 H01L29/22
代理机构 代理人 Figarella Luis
主权项 1. A high output light emitting diode (LED) based lighting module, comprising: an LED substrate board having two or more LEDs mechanically mounted onto at least one face of said substrate board; a fiber optic mounting assembly having two or more slot assemblies, each said slot assembly having a through opening, said opening going from the front face of said mounting assembly to the back face of said slot assembly, with, each said opening designed to securely hold a light fiber bundle so that two or more of the ends of said fiber bundles located at said back face of said mounting assembly present a uniform surface so the individual profile of each individual fiber end mates with an individual LED mounted on said LED substrate, so that each light fiber bundle slightly overlaps the active area of the respective LED it is mated to; and mechanical means for holding said fiber optic mounting assembly at a fixed distance from said LED substrate.
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