发明名称 Intrusion resistant thermal laminating film
摘要 A thermal laminating film is provided that has superior intrusion resistance that is well suited to addressing security and anti-counterfeiting needs. The film includes a polymer substrate and an adhesive system with a polymer component having a Vicat softening point temperature that is close to a glass transition temperature of the polymeric substrate, which typically is not greater than about 95° C.
申请公布号 US8852738(B2) 申请公布日期 2014.10.07
申请号 US200612064278 申请日期 2006.08.31
申请人 Transilwrap Company, Inc. 发明人 Albert Timothy W.;Flaherty Robert C.
分类号 B32B27/08;C09J7/02 主分类号 B32B27/08
代理机构 Cook Alex Ltd. 代理人 Cook Alex Ltd.
主权项 1. An Intrusion resistant thermal laminating film comprising: (a) a self-supporting polymeric substrate having a glass transition temperature of not greater than about 95° C., the polymeric substrate being selected from the group consisting of a polycyclohexylenedimethylene terephthalate (PCTA), glycol-modified polycyclohexylenedimethylene terephthalate (PCTg), and combinations thereof; (b) a thermal adhesive system adhered to said polymeric substrate to form an intrusion resistant thermal laminating film, said adhesive system is a blend of 35 to 55 weight percent of low density polyethylene (LDPE), 35 to 55 weight percent of maleic anhydride modified linear low density polyethylene (MA-LLDPE), and greater than 5 and less than 15 weight percent of ethylene ethyl acrylate (EEA) copolymer based on the total weight of the thermal adhesive system; wherein said adhesive system having a Vicat softening point that is below the polymeric substrate glass transition temperature and between about 80° C. and 95° C. and said adhesive system having a melt flow index (MFI) of about 15 grams or less per ten minutes; wherein the intrusion resistant thermal laminating film maintains adhesion between the adhesive system and the polymeric substrate and achieves cohesive failure of the adhesive system upon subjecting the intrusion resistant thermal laminating film to an elevated temperature below the polymeric substrate glass transition temperature.
地址 Franklin Park IL US