Power module

摘要

A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

主权项

1. A power module, comprising:
a power module pre-product having a multilayer substrate body comprising:
a heat plate, one surface side of which is joined to one surface of an insulating substrate;a power module substrate which is joined to the other surface of the insulating substrate and formed with a circuit pattern;a power semiconductor element disposed on the circuit pattern of the power module substrate; anda pair of external connecting terminals, arranged in a standing state in an orthogonal direction to a surface of the power module substrate, and electrically connected to the power semiconductor element; and a molding resin layer which seals the power module pre-product in a state where externally exposed end portions on one end sides of the pair of the external connecting terminals and the other surface side of the heat plate are each exposed to the outside, wherein an aligning hole is formed in a cylindrical body formed in a protruding manner on the surface of the power module substrate constituting the multilayer substrate body.